2009-07-07 1 esd8v0l... low capacitance tvs diode ? esd / transient protection of high-speed data lines in 3.3 / 5 / 12 v applications according to: iec61000-4-2 (esd): up to 25 kv (contact) iec61000-4-4 (eft): 40 a (5/50 ns) iec61000-4-5 (surge): up to 2.5 a (8/20 s) ? smallest form factor down to 1.0 x 0.6 x 0.4 mm ? max. working voltage: -8 / +14 v or +8 / -14 v ? very low capacitance down to 2 pf ? very low reverse current < 1 na typ. ? very low series inductance down to 0.4 nh ? pb-free (rohs compliant) package ? qualified according aec q101 applications ? usb 2.0, 10/100 ethernet, firewire, dvi ? mobile communication ? consumer products (stb, mp3, dvd, dsc...) ? lcd displays, camera ? notebooks and destop computers, peripherals esd8v0l2b-03l ESD8V0L2B-03LRH esd8v0l1b-02lrh 2 1 2 1 3 d2 d1 type package configuration marking esd8v0l1b-02lrh esd8v0l2b-03l ESD8V0L2B-03LRH* tslp-2-17 tslp-3-1 tslp-3-7 1 channel, bi-directional 2 channels, bi-directional 2 channels, bi-directional b3 b3 on request * preliminary data
2009-07-07 2 esd8v0l... maximum ratings at t a = 25c, unless otherwise specified parameter symbol value unit esd contact discharge 1) esd8v0l1b-02lrh esd8v0l2b..., between all pins v esd 25 15 kv peak pulse current ( t p = 8 / 20 s) 2) esd8v0l1b-02lrh esd8v0l2b... i pp 2.5 1 a operating temperature range t o p -55...125 c storage temperature t st g -65...150 1 v esd according to iec61000-4-2 2 i pp according to iec61000-4-5
2009-07-07 3 esd8v0l... electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. characteristics reverse working voltage v rwm -8 - 14 v breakdown voltage i (br) = 1 ma, from pin 2 to 1, esd8v0l1b-02lrh i (br) = 1 ma, from pin 1 to 2, esd8v0l1b-02lrh i (br) = 1 ma, from pin 1/2 to 3, esd8v0l2b... i (br) = 1 ma, from pin 3 to 1/2, esd8v0l2b... i (br) = 1 ma, from pin 1 to 2, esd8v0l2b... v (br) 14.5 8.5 14.5 8.5 23 - - - - - - - - - - reverse current v r = 3 v, between all pins i r - < 1 50 na clamping voltage for esd8v0l2b... v esd = +15 kv (contact) 1) , from pin 1/2 to 3 v esd = -15 kv (contact) 1) , from pin 1/2 to 3 v cl - - 26 20 - - v line capacitance 2) v r = 0 v, f = 1 mhz, esd8v0l1b-02lrh v r = 0 v, f = 1 mhz, esd8v0l2b..., from pin 1/2 to 3 from pin 1 to 2, pin 3 is not connected c t - - - 8.5 4 2 13 7 4 pf dynamic resistance ( tp=30ns ) esd8v0l1b-02lrh esd8v0l2b... r d - - 0.3 0.6 - - ? 1 v esd according to iec61000-4-2 2 total capacitance line to ground
2009-07-07 4 esd8v0l... reverse current i r = ? ( v r ) t a = parameter 0 2 4 6 8 10 v 14 v r -2 10 -1 10 0 10 1 10 na i r ta = 25c ta = 85c diode capacitance c t = ? (v r ) f = 1mhz 0 5 v 15 v r 0 1 2 3 4 5 6 7 8 pf 10 c t esd8v0l1b-02lrh esd8v0l2b..., pins 1/2 to 3 esd8v0l2b..., pins 1 to 2
2009-07-07 5 esd8v0l... application example esd8v0l2b... 2 channels, bi-directional esd sensitive device i/o i/o the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible . pin 3 should be connected directly to a ground plane on the board . 2 protected signal lines, level up to -8v/+14v or +14v (uni-directional) 1 2 3 connector application example esd8v0l2b... 1 high-speed channel, bi-directional esd sensitive device i/o pin 1 (or pin 2) should be connected directly to a ground plane on the board. pin 3 is not connected. connector protected high-speed signal line, level up to 22v (bi-directional) 1 2 3 application example esd8v0l1b-02lrh 1 channel, bi-directional esd sensitive device i/o 2 1 pin 1 (or pin 2) should be connected directly to a ground plane on the board . connector protected signal line, level up to -8/+14v or +8/-14 v
2009-07-07 6 esd8v0l... package tslp-2-17 1 2 0.05 0.6 1 2 0.05 0.65 0.035 0.25 1) 1 0.05 0.05 max. +0.01 0.39 -0.03 1) dimension applies to plated terminal cathode marking 1) 0.035 0.5 bottom view top view package outline foot print marking layout (example) standard packing reel ?180 mm = 15.000 pieces/reel reel ?330 mm = 50.000 pieces/reel (optional) for board assembly information please refer to infineon website "packages" 0.45 0.275 0.275 0.375 0.925 copper solder mask stencil apertures 0.35 1 0.6 0.35 0.3 0.76 4 1.16 0.5 cathode marking 8 bar90-02lrh type code cathode marking laser marking
2009-07-07 7 esd8v0l... package tslp-3-1 2 3 1 0.4 +0.1 bfr193l3 type code pin 1 marking laser marking 0.76 4 1.16 0.5 pin 1 marking 8 reel ?180 mm = 15.000 pieces/reel for board assembly information please refer to infineon website "packages" package outline foot print marking layout (example) standard packing stencil apertures copper solder mask 0.275 0.2 0.315 0.945 0.45 0.17 0.355 0.2 0.35 0.225 1 0.6 0.225 0.15 0.35 0.3 r0.1 1 2 0.05 0.35 0.035 2 x 0.15 1) top view bottom view 1) dimension applies to plated terminal 0.035 0.5 1) 0.05 0.6 3 0.05 0.65 0.035 2x 0.25 1) 0.035 0.25 1) 1 0.05 pin 1 marking 0.05 max.
2009-07-07 8 esd8v0l... package tslp-3-7 2 3 1 reel ?180 mm = 15.000 pieces/reel for board assembly information please refer to infineon website "packages" package outline foot print marking layout standard packing stencil apertures copper solder mask 0.275 0.2 0.315 0.945 0.45 0.17 0.355 0.2 0.35 0.225 1 0.6 0.225 0.15 0.35 0.3 r0.1 1 2 0.05 0.35 0.035 2 x 0.15 1) bottom view 0.035 0.5 1) 0.05 0.6 3 0.05 0.65 0.035 2x 0.25 1) 0.035 0.25 1) 1 0.05 +0.01 0.39 -0.03 pin 1 marking 0.05 max. top view 1) dimension applies to plated terminal 2) only for diodes, cathode marking on pin 3 cathode 2) marking type code pin 1 marking type code cathode marking only for diodes, cathode marking on pin 3 standard only for diodes, cathode marking on pin 3 standard 0.76 4 1.16 0.5 cathode marking 8 0.76 4 1.16 pin 1 marking 8
2009-07-07 9 esd8v0l... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
|
